Product usage: 
Used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment.
 
Product features:
Integrated human-machine operating system, continuous automated production, high work efficiency, saving labor costs, electricity and process time.
Ceramic fin heater, ring-shaped surrounding heating;
Ultimate vacuum degree: ≤10pa; optional (oxygen content index: ≤50ppm at normal temperature; ≤30ppm at high temperature)