Wafer handling | EFEM : 6” / 8” SMIF or 12” FOUP |
Wafer Type | Opaque wafers, such as bare silicon wafers, oxides, nitrides, etc. |
Wafer Warpage | No more than 100um |
Wafer thickness | 350um~1.5mm ( open and clamp at the bottom of the wafer) |
Lighting system | Oblique incidence dark field, differential interference bright field |
Non-patterned wafer particle detection sensitivity | 51nm |
Detection defect classification | Particle, scratch, pit, bump, Haze map |
Process Node | 90,130nm |
Options Available
- /OCR: OCR, recognition rate ≥ 99% (in compliance with SEMI font standards, except for unclear lettering)
- /IV: Offline image viewing software, can be used for offline analysis
- /SG: SECS-GEM, supports SEMI automation standard SECS/GEM communication interface, complies with SEMI E5- (SECS-II), SEMI E30- (GEM), SEMI E37- (HSMS) communication standards, and reserves other communication protocol interfaces
- /PSL:PSL Si standard film
F2000 IC Front-end Wafer Defect Inspection Equipment
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