top of page

Wafer handling

EFEM :  6” / 8” SMIF or  12” FOUP

Wafer Type

Opaque wafers, such as bare silicon wafers, oxides, nitrides, etc.

Wafer Warpage

No more than 100um

Wafer thickness

350um~1.5mm ( open and clamp at the bottom of the wafer)

Lighting system

Oblique incidence dark field, differential interference bright field

Non-patterned wafer particle detection sensitivity

51nm

Detection defect classification

Particle, scratch, pit, bump, Haze map

Process Node

90,130nm

 

Options Available 

 

  • /OCR: OCR, recognition rate  99% (in compliance with SEMI font standards, except for unclear lettering)
  • /IV: Offline image viewing software, can be used for offline analysis
  • /SG: SECS-GEM, supports SEMI automation standard SECS/GEM communication interface, complies with SEMI E5- (SECS-II), SEMI E30- (GEM), SEMI E37- (HSMS) communication standards, and reserves other communication protocol interfaces
  • /PSL:PSL Si standard film

F2000 IC Front-end Wafer Defect Inspection Equipment

Request for Quotation
    bottom of page