Wafer handling
EFEM :  6” / 8” SMIF or  12” FOUP
Wafer Type
Opaque wafers, such as bare silicon wafers, oxides, nitrides, etc.
Wafer Warpage
No more than 100um
Wafer thickness
350um~1.5mm ( open and clamp at the bottom of the wafer)
Lighting system
Oblique incidence dark field, differential interference bright field
Non-patterned wafer particle detection sensitivity
51nm
Detection defect classification
Particle, scratch, pit, bump, Haze map
Process Node
90,130nm
 
Options Available 
 
/OCR: OCR, recognition rate ≥ 99% (in compliance with SEMI font standards, except for unclear lettering)
/IV: Offline image viewing software, can be used for offline analysis
/SG: SECS-GEM, supports SEMI automation standard SECS/GEM communication interface, complies with SEMI E5- (SECS-II), SEMI E30- (GEM), SEMI E37- (HSMS) communication standards, and reserves other communication protocol interfaces
/PSL:PSL Si standard film