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CMDB15000A Automatic Roll-to-Roll Die Bonder
Technical Specification: Die bonding accurarcy ±25μm
Compatible with 8~12 inch wafer tray
Support Mapping
Processing chip specification 0.25*0.25mm-10*10mm
The width of the substrate is 28-83mm, and the maximum reel diameter of the substrate is 600mm 
Wire speed 40ms 
Total power 1.7KW

CMDB15000A Automatic Roll-to-Roll Die Bonder

庫存單位： ZL162255
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