ZLWX3000032 Cyberoptics
CyberOptics 3D.2D Inspection & Measurement
 
Feature
Metrology-Grade Accuracy with MRS Technology
  -Sub-micrometer accuracy for features as small as 25 µm
  -Accurately inspect shiny or mirror-like surfaces.
  -Attain repeatable and reproducible measurements
Fast, Superior Inspection Performance
  -Increase throughput with the MRS sensor that is 2-3X faster than
   alternate technologies, delivering greater than 25 wafers
   (300mm) per hour.
  -Attain 3D and 2D measurements in one pass versus multiple
    separate scans.
  -Conduct 100% 3D and 2D metrology and inspection versus
    sampling-only methods.
Versatility for Wafer-Level and Advanced Packaging Applications
  -Measure and inspect a wide range of semiconductor applications
    including gold bumps, solder balls and bumps, wafer bumps,
    copper pillars and other wafer-level and advanced packaging
    applications.
  -Measure and inspect critical packaging features including bump
    height, coplanarity, diameter and shape, relative location and
    variety of other measurements."
  -The 3-micron Nano Resolution (X/Y resolution of 3micron, Z
   resolution of 50 nanometer)