Features
Wafer Size：8” -12”
Dual CCD Function (Bottom & Top)
   - Automatic Focus system
   - Automatic dimming system
   - Wafer Map Auto creation "
3D Function: Wafer marking depth measurement (1~50um, resolution 0.1um)
2D Function: Laser Marking Shift & width measurement(10~100um, resolution 1um)
Support OHT/AGV/SECS GEM200 OR GEM300
Support Ultra-Thin & high warpage wafer
ESD protection
Wafer Top & Bottom marking shift measure after laser making
Scribe Line &marking measure