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Features

  • Wafer Size:4~6”/6~8”/8~12” 
  • Packing, Unpacking, sorting. 
  • Pre-Aligner for Wafer notch & Flat, Wafer ID reader 
  • Auto detect Wafer / Interleaf / Foam/Ring "
  • Carriers compatibility : SEMI Standard 
  • -300 mm: 25 slots FOUP / FOSB(manual & auto door) / 25 wafers HWS 
  • -200 mm: 25 slots Open Cassette / 25 wafers HWS/Jar" "
  • -150 mm: 25 slots Open Cassette / 25 wafers HWS/Jar 
  • -100 mm: 25 slots Open Cassette / Jar" 
  • ESD protection

Auto Wafer Packing & Unpacking System

SKU: ZL011026
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