Features:
300mm Wafer packing, unpacking and sorting (200mm Option)
SEMI S2/S8 Compliant - 3rd party certification
SEMI SECSGEM300 Host Compliant
Rorze RR756 robot with compliance, flip module and multi chamber wafer handling and effector
2 or 4 - Rorze RV-201 Linear or front/rear FOUP/FOSB LP with RFID
E84 FOUP/FOSB Transfer to RV201 LP
Single Stocker with 2- HWS LP and three (3) reservoir drawers for       interleaves, ring separators or foam cushions
Baumer Camera detection of packing media
Automated HWS lid removal/replacement (EVO2 AUT0 Option)
Automated HWS transfer stage (EVO2 AUTO Option)
Class 10 Mini Environment
Throughput: 140 WPH Packing, 125 WPH Unpacking
Footprint: 4LP - 1309mm Dx 2524mm W, 6LP -1802mm D x2524mm W)