Features
Film Frame and/or wafer packing, unpacking and sorting
SEMI S2/S8 Compliant- 3rd party certification
Rorze RR757 dual arm robot with interference management with            fixed Ti EE for film frame and flip EE for wafer handling
2- modified Rorze RV-201 LP for FOUP, FOSB, or 300mm dicing                cassette with RFID
E84 FOUP/FOSB Transfer to RV201 LP (Optional)
Dual Stocker configuration with 1- Wafer HWS LP for wafer and/or          FFS LP(per stocker)with RFID
Sliding Drawer HWS/FFS LP- PGV Accessible
3- Reservoir Drawers for interleave, ring, and foam cushion                     handling(per stocker)
Baumer Camera detection of packing media
Automated HWS/FFS lid removal/replacement(Optional)
Class 10 Mini Environment * Throughput: 140 WPH Pack,                             110 WPH  Unpack
Footprint (dual stocker): 2215mm D x 2610mm W