SPEC - Model: WLP2000
substrate size: 300/200/150mm
substrate thickness: 0.02-4mm
Warpage Handling: ±5mm
Resolution: 2um
Overlay: ±0.6um
Backside Alignment: <=2um
CDU：±10%
Laser wavelength：375/405nm 
WPH: 40 @ 6inch, 20@12inch
Application
FO WLP, 2.5D, FI WLP, Flip Chip, SOW
 
Feature
Maskless 
WEE/WEP
Warpaged wafer handling
EFEM support
Auto Focus 
Smart RDL
Intelligent PI correction