Application introduction: Mainly doing BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS), FPD, high-precision electronic components, electronic ceramic materials dust-free drying, electrical products Drying and aging tests of materials, spare parts, etc. in high-temperature clean and oxygen-free vacuum environments.
Main features: save nitrogen (30LPM), have the characteristics of fast heating, energy saving, etc., unique air supply and exhaust system to ensure uniform temperature of the furnace box, metal filter to ensure cleanliness requirements.
 
 
Technical indicators:
2.1 Long-term use temperature: 400℃; (maximum temperature: 450℃)
2.2 Temperature uniformity: ≤2%MFS;
2.3 Maximum heating rate: ≤6℃/min;
2.4 Cooling rate: 400℃-80℃, ≤1.5h;
2.5 Ultimate vacuum degree: ≤10pa;
2.6 Oxygen content index: ≤50ppm at normal temperature; ≤30ppm at high temperature
2.7 Cleanliness: class100
2.8 Heating method: ceramic fin heater, ring-shaped surrounding heating;
   model
  MOLZK-32D1
  MOLZK-118D1