Process :
Etch, PR Strip, Debond Clean, Glass Clean, Film frame Wafer Clean
 
Solutions :
Advanced Semiconductor Packaging, 2.5D/3D IC Packaging
 
Key Features:
- Integration of temporary bonding carrier de-bonding and spin cleaning functions in one machine to meet total process solution needs and enhance production efficiency.
- Integration of vertical immersion and spin cleaning functions in one machine to meet processes requiring both immersion and high-pressure cleaning, optimizing cleaning capabilities.
- Optimized process chamber design achieves wafer cleanliness meeting sub-micron requirements.
- Integration of optical inspection systems for early detection of wafer or substrate defects, reducing process scrap rates.
- Equipped with wafer flipping capabilities to meet double-sided processing requirements.