CLC supplies high-quality Titanium-Tungsten (TiW) etchants for gold bump process.
 
Detail:
CLC is a supplier of hihg-quality Titanium-Tungsten (TiW) etchants used in the gold bump process, which is commonly used in display driver IC packaging. TiW serves as the adhesion layer between Au and substrate, as well as the UBM layer in the gold bump process.
 
Traditionally, hydrogen peroxide was used as a TiW etchant for the gold bump process, but the high-temperature (60~70˚C) required could lead to abnormal heating-up or chemical boiling from its exothermic decomposition, resulting in safety concerns.
 
To address this issue, CLC's hydrogen peroxide series TiW etchant incorporates an H202 stabilizer in the formulation and operates at a lower temperature (40˚C) to ensure process stability and safety.