Process :
Wafer Clean, Flux Clean, Mask Clean
 
Solutions :
Advanced Semiconductor Packaging, 2.5D/3D IC Packaging, Compound Semiconductors, Silicon Wafer Manufacturing, SiC Wafer Manufacturing, MOSFET Backend Processes (BGBM)
 
Key Features:
- Dual robotic arms design, suitable for short recipe process and optimized production output.
- Process chamber equipped with high-pressure cleaning, hot water cleaning, and double-sided cleaning capabilities, optimizing cleaning performance.
- Optimized process chamber flow field design, complemented by two-fluid soft spray cleaning, to enhance wafer cleanliness.