Process :
Etch, PR Strip, Wafer Cleaning
 
Solutions :
Advanced Semiconductor Packaging, 2.5D/3D IC Packaging, Compound Semiconductors, Silicon Wafer Manufacturing, SiC Wafer Manufacturing, MOSFET Backend Processes (BGBM)
 
Key Features:
- Integration of an etch endpoint detection system to enhance production efficiency and reduce manufacturing costs.
- Capability to incorporate a concentration monitoring system, ensuring process stability through precise chemical concentration control.
- Equipped with multi-layer chemical recycling rings and a chemical solution recovery mechanism, supporting continuous processing requirements while reducing chemical usage and lowering production costs.
- Static electricity protection mechanism to prevent process defects caused by electrostatic discharge.
- Specifically designed for handling highly warped wafers, effectively addressing wafer transport and clamping challenges.
- Customizable solutions for addressing process challenges related to chemical viscosity, foaming, residue, and other characteristics.
- Optimized process chamber flow field design, complemented by two-fluid soft spray cleaning, to enhance wafer cleanliness.
- Customizable options for acid mixing, preheating, and supply to accommodate diverse process needs.