Application introduction:
During the packaging process of semiconductor chips, the sealing material will absorb water vapor or generate volatile substances, or generate empty cavity (air bubbles) during the process. During the Reflow process of IC components, the water vapor and cavity will instantly expand after heating the water vapor and the cavity after heating, resulting in a great stress that the chip and packaging body themselves may cause IC components to fail. However, these stress do not necessarily cause IC to fail immediately, so it will seriously affect the reliability and quality of the product for IC packaging, FLIP Chip (sculpture), Bumping (buckle), wafer packaging or wafer packaging or wafer packaging or wafer packaging Panel process, etc.
 
Technical Parameters:
Temperature range
+30-200 ° C (a) or 350 (b) can be set at arbitrarily.
Timing
0-12 H 59min per section, the error is less than 1min, and can be programmed 50.
Temperature display error
± 3 ℃, temperature control accuracy ± 1 ℃.
Temperature uniformity
200 ° C within ± 3 ° C (test).
Heating up
Room temperature rises to 200 ℃ ≤18min (air furnace).
Cooling system
The cooling system is used in the cooling system, the water temperature is about 20 ° C, and the water flow is 2 ~ 10slm.
Cooling speed
Water pressure is 2 ~ 5kg, from 200 ° C to 80 ° C time ≤24min (empty furnace).
Maximum work restriction
8KG/cm2 , error ±0.1 KG/cm2。