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CLC offers nitric acid series NiV etchants for use in wet bench and spin process machines, which can be utilized in both NiV/Cu etching processes.

 

Detail:

The BGBM (Backside Grinding, Backside Metallization) process employs a Ti/NiV/Ag stacking structure.

 

CLC offers nitric acid series NiV etchants for use in wet bench and spin process machines, which can be utilized in

NiV Etchant

SKU: ZLCHEM150
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