Main functions:
Wafer transfer
Edge alignment
Juguan personnel inspection: 360 degree selection
Crystal back inspection: reversible
 
Features:
Applied to third generation semiconductor materials
Overcome edge-finding alignment of transparent and translucent materials
Can transport thinned wafers (>80um)
 
Application method:
Can be used with various devices for transmission such as
Desktop microscopes (Leica, Nikon, etc..)
3D measuring equipment
Film thickness measuring instrument
Wafer AOI equipment
4PP probe measurement equipment
Laser marking equipment