Product usage:
Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, fingerprint recognition, IGBT); integrated circuit wafer rapid annealing furnace/alloy furnace.
 
Product features:
Integrated human-machine operating system, continuous automated production, high work efficiency, saving labor costs, electricity and process time.
FEC heating, rapid temperature rise and good uniformity
Comes with self-cleaning function - high temperature cleaning