Product Usage:
It is used for IC integrated circuits, MEMS, electrical electronic devices, optoelectronic devices and other fields. It is mainly suitable for the alloy and annealing of the wafer of 6 ", 8", and 12 "wafers.
The annealing is a process of getting into the inert gas (N2) under the low temperature conditions, eliminating the lattice defect and lattice damage of the silicon wafer interface, and optimizing the quality of the silicon wafer interface.
 
Features:
1. All -in -one man -machine operating system, continuous automation production, high work efficiency, saving labor costs, electrical energy and process time;
2. Fec heated, the temperature heating is rapid and uniform;
3. Quality stainless steel material, the surface is treated with physics and chemical polishing to ensure cleanliness