Au etchant is a crucial component in the gold bump process of display driver ICs or optoelectronic applications, and it can also provide optional features of Al and Ni protection.
 
Detail:
In the gold bump process of display driver ICs, sputtered Au is used as the UBM (Under Bump Metallization) layer, providing uniform current density throughout the entire wafer as the seed layer of the electroplating process of gold bump. Gold is also used as the electrode in LEDs.
 
CLC is proud to offer a variety of high-quality Au etchants for different applications, including iodine series and nitric acid series. For gold bump applications, CLC provides Au etchants with optional aluminum protection to prevent corrosion of the Al pad under the gold bump.
 
Type
Iodine series
Nitric Acid series
Main Composition
KI/I2
 Nitric Acid
Application
Gold bump
Optoelectronics
Optoelectronics
 Other Features
Al protection
Ni protection