Wafer Size: ≤ 200mm(8’’)
Bonding Force: ≤ 60kN
Bonding Temperature: 550°C (Option : 650 °C)
Chamber Vacuum: 10-5mbar (Option : 10-6mbar)
Bonding Method: 
- Fusion Bond
- Anodic Bond
- Eutectic Bond
- Adhesive Bond
- Metal Diffusion Bond