CLC offers both phosphoric acid and nitric acid series Ag etchants that are compatible with both wet bench and spin process tools.
 
Detail:
The BGBM (Backside Grinding, Backside Metallization) process utilizes a Ti/NiV/Ag stacking structure.
 
To facilitate this process, CLC offers both phosphoric acid and nitric asid series Ag etchants that are compatible with both wet bench and spin process tools.