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ADC-08 Carriera Series Thermal Wafer De-Bonder
Wafer Size : ≤ 200mm(8’’)
Wafer Thickness : 50um~1000um
De-Bonding Temperature ： ≤ 350°C
WPH≈12
 

ADC-08 Carriera Series Thermal Wafer De-Bonder

SKU: ZL123216
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