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Wafer Size: 300mm(12’’)
Bonding Force: ≤ 60kN
Bonding Temperature:  ≤ 350°C
Chamber Vacuum: 10-2mbar
Bonding Shift: ≤ 0.1mm

ABT-12 Aviator Series Temporary Wafer Bonder for Advanced Semiconductor

SKU: ZL131224
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