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ABT-08 Carriera Series Temporary Wafer Bonder for glue/wax
Wafer Size : ≤ 200mm (8’’)
Bonding Force : 400N~20kN
Bonding Temperature： ≤ 350°C
Chamber Vacuum：10-1mbar
Bonding Shift：≤ 0.1mm
WPH ≈12

ABT-08 Carriera Series Temporary Wafer Bonder for glue/wax

SKU: ZL122215
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