Capacity： 25
Dimension: 234mm x 203mm x 219mm
D1 Dimension: 25.4mm
Pocket pitch: 6.35mm
Pocket flat: 2.0mm
Compatible box: BX200-0, BX200-02, BX200DS, BX200-12-C007, BX200H
H-shaped end for equipment interface.
E-shaped handle on end wall.
Wash slots in sidewalls.
Excellent heat resistance and rigidity. Ideal for use in high temperature applications such as wafer baking, diffusion and CVD.
Enchanced stability for horizontal wafer handling.