The (111)nt-Cu Electroplating Solution adds special additives to the Cu electroplating solution to deposit a copper coating with a patented Cu micro-structure using the electrochemical electroplating process.
 
Detail:
What is (111) nanotwinned copper (nt-Cu)
 
Highly (111) oriented nt-Cu was published by Prof. Chih Chen, National Chiao Tung University, Hsinchu, Taiwan, in 2012. This specific copper microstructure is achieved via electrodeposition method using proprietary plating additive designed and synthesized by CLC. The artificial microstructure possesses high density nanometer-spacing twins in columnar grain with unidirectional (111) orientation.
 
Material Properties of (111) nt-Cu
High tensile strength
High thermal stability
High conductivity
Excellent electromigration resistance
Low Kirkendall void in Sn/Cu stacking

Applications of (111) nt-Cu in semiconductor packaging
Fine line RDL in fan-out packaging
Low temperature Cu to Cu direct bond in 3D IC
High conductivity Cu interconnect